Liquid crystal display panel and method of fabricating the same

ABSTRACT

A liquid crystal display panel having a display area comprises a first substrate, a second substrate, a sealant, a liquid crystal layer, and a light-shielding layer. The sealant is disposed between the first substrate and the second substrate. The liquid crystal layer is disposed in a space defined by the first substrate, the second substrate and the sealant. The light shielding layer is disposed on a first outer surface of the first substrate or a second outer surface of the second substrate, wherein the light shielding layer and the display area are not overlapped. In addition, the liquid crystal display panel further comprises a protection layer. Since the protection layer encapsulates the light-shielding layer, out-diffusion of dye within the light-shielding layer is effectively prevented.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a divisional application of application ofapplication Ser. No. 10/904,520, filed on Nov. 15, 2004, which is acontinuation in part (CIP) application of application Ser. No.10/709,431, filed on May 5, 2004. The continuation in part (CIP)application of application Ser. No. 10/709,431 claims the prioritybenefit of Taiwan application serial No. 93100862, filed on Jan. 14,2004. The entirety of the above-mentioned patent applications is herebyincorporated by reference herein and made a part of this specification.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a liquid crystal display panel and amethod of fabricating the same, and more particularly, to a liquidcrystal display and a method of fabricating the same capable of reducinglight leakage at edges of bezel of a liquid crystal display module.

2. Description of Related Art

Liquid Crystal Display (LCD) has such advantages as small size, lowweight, low driving voltage, low power consumption, and portability andhas been applied in the display of the portable terminal system for thepast twenty years and become an indispensable item for modern life.

A One Drop Fill (ODF) process is adapted for mass producing alarge-panel LCD display in which amount of the liquid crystal can beproperly controlled for reducing the fabrication costs. Further, the ODFprocess is capable of substantially reducing the process time of fillingthe liquid crystal. Therefore, the ODF process can be meaningfullyapplied for mass-production LCD display.

In a typical ODF process, an ultraviolet-curable glue (UV-curable glue)is coated on a thin film transistor array substrate or on a color filtersubstrate to define a sealed area. Then the liquid crystal is droppedinto the sealed area. The thin film transistor array substrate isattached to the color filter substrate. Finally, the resulting structureis exposed to, for example, an UV light, for curing the UV-curable glueand thereby bonding the substrates.

FIG. 1 is a cross-sectional view showing a conventional liquid crystaldisplay module formed by using the ODF process. For simplification, FIG.1 shows only the essential elements of an LCD display. With reference toFIG. 1, the liquid crystal display module comprises at least a thin filmtransistor array substrate 102, a color filter substrate 104, a blackmatrix layer 106, a sealant 108, a liquid crystal layer 110, polarizers112 and 114, and a bezel 116. The black matrix layer 106 is disposed onthe color filter substrate 104. The sealant 108 is disposed between thethin film transistor array substrate 102 and the color filter substrate104. The liquid crystal layer 110 is disposed in the sealed spacedefined by the thin film transistor array substrate 102, the colorfilter substrate 104 and the sealant 108. The polarizers 112 and 114 areseparately disposed over the outer surfaces of the color filtersubstrate 104 and the thin film transistor array substrate 102 such thatthe polarizers 112 and 114 do not contact the liquid crystal layer 110.The bezel 116 encloses a liquid crystal cell including the thin filmtransistor array substrate 102, the color filter substrate 104, theblack matrix layer 106, the sealant 108, the liquid crystal layer 110and the polarizers 112 and 114.

The sealant 108 is cured by exposing the sealant 108 to the UV lightduring the ODF process, and therefore it is important to ensure that theblack matrix layer 106 does not block the sealant 108 when performingthe UV exposure. Moreover, the ODF process requires that the blackmatrix layer 106 over the color filter substrate 104 should be separatedfrom the sealant 108 with a predetermined distance as shown in FIG. 1.

Today, the process of fabricating the liquid crystal displaypanel/module should fit the Standard Panel Work Group (SPWG)specification. Although the LCD display is being fabricated using theODF process fitting the SPWG specification, light leakage 120 willinvariably occur at the edges of the bezel 116 at about the view angle45° as shown in the magnified view of part A.

In order to shield the leakage light, some prior arts proposed to extendthe black matrix layer 106 more to the side. But to fit the design ruleof the ODF process, the dimension of the liquid crystal cell must beincreased. Accordingly, the electronic products having the liquidcrystal cell cannot satisfy the SPWG specification.

SUMMARY OF THE INVENTION

Accordingly, the present invention is directed to a liquid crystaldisplay panel and a fabrication method thereof capable of reducing thelight leakage of the liquid crystal display module.

The present invention is also directed to a liquid crystal display paneland a fabrication method thereof using the ODF process fitting the SPWGspecification. Further, the light leakage of the liquid crystal displaymodule fabricated using the ODF process can be reduced.

According to an embodiment of the present invention, the liquid crystaldisplay panel comprises at least a first substrate, a second substrate,a sealant, a liquid crystal layer and a light-shielding layer. The firstsubstrate has a first inner surface and a first outer surface. Thesecond substrate has a second inner surface and a second outer surfaceand is disposed above the first substrate. The sealant is disposedbetween the first substrate and the second substrate. The liquid crystallayer is disposed in a space defined by the first inner surface of thefirst substrate, the second inner surface of the second substrate andthe sealant. The light-shielding layer is disposed on the first outersurface of the first substrate and/or the second outer surface of thesecond substrate, wherein the light-shielding layer and the display areaare not overlapped.

According to an embodiment of the present invention, the method offabricating the liquid crystal display panel is provided. First, a firstsubstrate having a first inner surface and a first outer surface and asecond substrate having a second inner surface and a second outersurface are provided. Next, a sealant is formed between the first innersurface of the first substrate and the second inner surface of thesecond substrate. Then a liquid crystal layer is filled into a spacedefined by the first inner surface of the first substrate, the secondinner surface of the second substrate and the sealant. The firstsubstrate is attached to the second substrate, and the sealant isexposed to a light. Thereafter, a light-shielding layer is formed on thefirst outer surface of the first substrate and/or the second outersurface of the second substrate such that the light leakage iseffectively prevented.

According to an embodiment of the present invention, the material of thelight-shielding layer comprises, for example but not limited to, ink,such as black ink, deep-colored ink, or any other ink.

According to an embodiment of the present invention, the optical densityof the light-shielding layer is, for example but not limited to, 2.0 ormore than 2.0.

According to an embodiment of the present invention, the light-shieldinglayer is disposed over a peripheral area outside the display area. Forexample, the light-shielding layer is disposed on the first outersurface of the first substrate and/or the second outer surface of thesecond substrate.

According to an embodiment of the present invention, the light-shieldinglayer and the black matrix layer are partially overlapped, for example.Furthermore, the light-shielding layer and the sealant are partiallyoverlapped.

According to an embodiment of the present invention, the liquid crystaldisplay panel further comprises a first polarizer, a second polarizerand a protection layer. The first polarizer is disposed on the firstouter surface. The second polarizer is disposed on the second outersurface. The protection layer is disposed between the first polarizerand the light-shielding layer when the light-shielding layer is disposedon the first outer surface of the first substrate. In another embodimentof the present invention, the liquid crystal display panel furthercomprises a first polarizer, a second polarizer and a protection layer.The first polarizer is disposed on the first outer surface. The secondpolarizer is disposed on the second outer surface. The protection layeris disposed between the second polarizer and the light-shielding layerwhen the light-shielding layer is disposed on the second outer surfaceof the first substrate. Moreover, the light-shielding layer isencapsulated by the protection layer, for example.

According to an embodiment of the present invention, the first substrateis, for example, a thin film transistor array substrate, and the secondsubstrate is, for example, a color filter substrate. In anotherembodiment of the present invention, the first substrate is, forexample, a color filter on thin film transistor array substrate (COAsubstrate), and the second substrate is, for example, an oppositesubstrate having a common electrode.

According to an embodiment of the present invention, the light-shieldinglayer is formed on the substrate of the liquid crystal display panel.When the liquid crystal display panel is applied in an electronicproduct, the light-shielding layer is capable of reducing the lightleakage at the bezel edges of the liquid crystal display module.

According to an embodiment of the present invention, the light-shieldinglayer is formed on the substrate after the sealant is cured. Therefore,the liquid crystal display panel can be fabricated by using the ODFprocess fitting the SPGW specification. Furthermore, the light leakageof the liquid crystal display module fabricated using the ODF processcan be reduced.

One or part or all of these and other features and advantages of thepresent invention will become readily apparent to those skilled in thisart from the following description wherein there is shown and describedan embodiment of this invention, simply by way of illustration of one ofthe modes best suited to carry out the invention. As it will berealized, the invention is capable of different embodiments, and itsseveral details are capable of modifications in various, obvious aspectsall without departing from the invention. Accordingly, the drawings anddescriptions will be regarded as illustrative in nature and not asrestrictive.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view showing a conventional liquid crystaldisplay module fabricated by using an ODF process.

FIGS. 2A-2D are cross-sectional views showing progressive steps of anODF process of fabricating a liquid crystal display panel according tothe first embodiment of the present invention.

FIG. 3 is a top view of the liquid crystal display panel shown in FIG.2D.

FIG. 4 is a cross-sectional view showing a liquid crystal display modulefabricated using an ODF process according to the first embodiment of thepresent invention.

FIG. 5 is a cross-sectional view showing a liquid crystal display panelfabricated using an ODF process according to the second embodiment ofthe present invention.

FIG. 6 is a cross-sectional view showing a liquid crystal display modulefabricated using an ODF process according to the second embodiment ofthe present invention.

FIG. 7 is a cross-sectional view showing a liquid crystal display panelfabricated using an ODF process according to the third embodiment of thepresent invention.

FIG. 8 is a cross-sectional view showing a liquid crystal display modulefabricated using an ODF process according to the third embodiment of thepresent invention.

FIG. 9 is a cross-sectional view showing a liquid crystal display panelfabricated using an ODF process according to the fourth embodiment ofthe present invention.

FIG. 10 is a cross-sectional view showing a liquid crystal displaymodule fabricated using an ODF process according to the fourthembodiment of the present invention.

DESCRIPTION OF EMBODIMENTS First Embodiment

FIGS. 2A-2D are cross-sectional views showing progressive steps of anODF process of fabricating a liquid crystal display panel according tothe first embodiment of the present invention. For simplification, thefigures show only the essential elements.

With reference to FIG. 2A, a first substrate 202, such as a plasticsubstrate or a glass substrate, is provided. The first substrate 202 hasa first inner surface 202 a and a first outer surface 202 b. Next, aplurality of thin film transistors, scan lines, data lines and pixelelectrodes (not shown) are formed over the first inner surface 202 a ofthe substrate 202 to consist a thin film transistor array substrate. Forexample, the transistors may be α—Si TFTs, Poly-Si TFTs, or the like. Inaddition, the transistors may be top gate TFTs or bottom gate TFT. Inother words, each transistor may be a top gate TFT having an α—Sichannel layer, a bottom gate TFT having an α—Si channel layer, a topgate TFT having a Poly-Si channel layer, or a bottom gate TFT having aPoly-Si channel layer.

A second substrate 204, such as a plastic substrate or a glasssubstrate, is provided. The second substrate 204 has a second innersurface 204 a and a second outer surface 204 b. A plurality of colorfilter films (not shown) are formed, for example, on the substrate 204.Then a black matrix layer 206 is formed on the second inner surface 204a of the second substrate 204 to consist a color filter substrate. Thesealant 208 is formed between the first substrate 202 and the secondsubstrate 204. More specifically, the sealant is coated on the firstinner surface 202 a of the first substrate 202 or the second innersurface 204 a of the second substrate 204 to define a sealed area (notshown). In an embodiment of the present invention, the sealant 208 canbe, for example but not limited to, a radiation-curable glue, such as anultraviolet-curable glue.

With reference to FIG. 2B, liquid crystal is dropped into the sealedarea to form a liquid crystal layer 210. With reference to FIG. 2C, thefirst substrate 202 is attached to the second substrate 204. Then UVlight 212 is applied through the edges of the substrate 204 to cure thesealant 208, and thereby attaching the first substrate 202 onto thesecond substrate 204.

Please refer to FIGS. 2D and 3, wherein FIG. 3 is a top view of theliquid crystal display panel shown in FIG. 2D. A light-shielding layer214 is formed on the second outer surface 204 b of the substrate 204such that the light-shielding layer 214 does not contact the liquidcrystal layer 210. As shown in FIG. 3, the light-shielding layer 214 isdisposed on a peripheral area outside the display area 230 of the liquidcrystal display panel. In an embodiment of the present invention, thelight-shielding layer 214, for example, surrounds the display area 230and has a frame shape. Thereafter, a liquid crystal display panelcomprising the light-shielding layer 214 is fabricated according to theprocess described with reference to FIGS. 2A-2D.

According to an embodiment of the present invention, the light-shieldinglayer 214 is formed by using materials, for example, having an opticaldensity of about 2.0 or higher than 2.0. The material of thelight-shielding layer 214 comprises, for example but not limited to,black ink, deep-colored ink or any other ink, which can be formed, forexample, by using an ink jet printing method, a screen printing methodor a gravure printing method. Moreover, according to an embodiment ofthe present invention, the light-shielding layer 214 is capable ofshielding the light.

FIG. 4 is a cross-sectional view showing a liquid crystal display modulefabricated using an ODF process according to the first embodiment of thepresent invention. For simplification, FIG. 4 shows only the essentialelements. With reference to FIG. 4, the liquid crystal display modulecomprises the liquid crystal display panel of FIG. 2D, polarizers 216and 218, and a bezel 220. The liquid crystal display panel comprises thefirst substrates 202, the second substrate 204, the black matrix layer206, the sealant 208, the liquid crystal layer 210 and thelight-shielding layer 214.

According to an embodiment of the present invention, the black matrixlayer 206 is disposed on the second inner surface 204 a of the substrate204, the sealant 208 is disposed between the first substrate 202 and thesecond substrate 204. The liquid crystal layer 210 is disposed in thesealed space defined by the first substrate 202, the second substrate204 and the sealant 208. The light-shielding layer 214 is disposed onthe second outer surface 204 b of the second substrate 204 such that thelight-shielding layer 214 does not contact the liquid crystal layer 210.The light-shielding layer 214 is disposed on the peripheral area outsidethe display area (not shown) of the liquid crystal display panel. Theoptical density of the light-shielding layer 214 is, for example but notlimited to, 2.0 or higher than 2.0. The material of the light-shieldinglayer 214 can be, for example but not limited to, ink and the ink canbe, for example but not limited to, deep-colored ink, black ink or anyother ink.

According to an embodiment of the present invention, the light-shieldinglayer 214 may overlap the edge of black matrix layer 206 to reduce thelight leakage. Besides, the light-shielding layer 214 and the sealant208 are also partially overlapped, for example. In other words, thelight-shielding layer 214 is disposed on the second substrate 204 suchthat at least a portion of the black matrix layer 206 and/or the sealant208 is exposed.

With reference to FIG. 4, the polarizers 218 and 216 are disposed on thefirst outer surface 202 b of the first substrate 202 and the secondouter surface 204 b of the second substrate 204, respectively. Morespecifically, the polarizer 216 is disposed over the second substrate204 to cover the light-shielding layer 214. The bezel 220 encloses aliquid crystal cell including the first substrate 202, the secondsubstrate 204, the black matrix layer 206, the sealant 208, the liquidcrystal layer 210, the light-shielding layer 214 and the polarizers 216and 218.

When the exemplary liquid crystal display panel comprising thelight-shielding layer 214 of FIG. 2D is applied to the liquid crystaldisplay module, the light leakage 240 can be shielded by thelight-shielding layer 214 disposed on the second outer surface 204 b ofthe substrate 204 (as shown in the magnified view of part B). Therefore,the light leakage 240 at the edges of bezel 220 in the liquid crystaldisplay module can be effectively reduced.

Second Embodiment

In the embodiment described above, the light-shielding layer 214 isdisposed on the second outer surface 204 b of the second substrate 204(for example, the color filter substrate). However, the presentinvention present is not limited to the embodiment described above. FIG.5 is a cross-sectional view showing a liquid crystal display panelformed using an ODF process according to the second embodiment of thepresent invention. The elements of the liquid crystal display panel inFIG. 5 are similar to the liquid crystal display panel in FIG. 2 withthe same reference numbers and thus detailed descriptions thereof is notrepeated hereinafter.

Furthermore, the structure of the liquid crystal display panel in FIG. 5is similar to that in FIG. 2D except that the light-shielding layer 250is disposed on the first outer surface 202 b of the first substrate 202(for example, the thin film transistor array substrate). The liquidcrystal display panel can be fabricated using the process steps withreference to FIGS. 2A-2C described above. Further, the light-shieldinglayer 250 can be fabricated using a process similar to that used forfabricating the light-shielding layer 214 shown in FIG. 2D. Thelight-shielding layer 250 can be, for example, disposed on theperipheral area outside the display area 230 of the liquid crystaldisplay panel. In this embodiment, the light-shielding layer 250, forexample, surrounds the display area 230 and is in a shape of a frame.

FIG. 6 is a cross-sectional view showing a liquid crystal display modulefabricated using an ODF process according to the second embodiment ofthe present invention. In this embodiment, the liquid crystal displaypanel shown in FIG. 5 is utilized to fabricate the liquid crystaldisplay module. It should be noted that elements of the liquid crystaldisplay panel in FIG. 6 are similar to those in FIG. 4 and have the samereference numbers and thus detailed descriptions are not repeatedhereinafter. The structure of the liquid crystal display panel shown inFIG. 5 is similar to that shown in FIG. 4 except that thelight-shielding layer 250 is disposed on the first outer surface 202 bof the substrate 202. Further, because the material and location of thelight-shielding layer 250 are similar to those described in FIG. 5,detailed descriptions thereof are not repeated hereinafter.

When the liquid crystal display panel comprising the light-shieldinglayer 250 of the present embodiment (FIG. 5) is applied to the liquidcrystal display module, the light 260 emitted from the backlight module(not shown) can be shielded by the light-shielding layer 250 disposed onthe first substrate 202 (shown in FIG. 6). In other words, thelight-shielding layer 250 disposed on the first substrate 202 can shieldthe light leakage outside the display area 230. Therefore, the lightleakage at the edges of the bezel 220 of the liquid crystal displaymodule can be effectively reduced.

In an embodiment of the present invention, the thin film transistorarray substrate comprises, for example but not limited to, bottom gatethin film transistors. However, the present invention is not limitedthereto. According to an embodiment of the present invention, alow-temperature polysilicon thin film transistor process or any otheractive matrix liquid crystal display process may be applied forfabricating the liquid crystal display panel.

Third Embodiment

FIG. 7 is a cross-sectional view showing a liquid crystal display panelfabricated using an ODF process according to the third embodiment of thepresent invention. FIG. 8 is a cross-sectional view showing a liquidcrystal display module fabricated using an ODF process according to thethird embodiment of the present invention. With reference to FIG. 7 andFIG. 8, the structure of the liquid crystal display panel in FIG. 7 andFIG. 8 are similar to that in FIG. 2D except that a protection layer 260is disposed on the light-shielding layer 214. In other words, theprotection layer 260 is disposed between the polarizer 216 and thelight-shielding layer 214. It should be noted that the light-shieldinglayer 214 is encapsulated by the protection layer 260. Thereforeout-diffusion of dye within the light-shielding layer 214 is effectivelyprevented.

More specifically, the out-diffusion of dye within the light-shieldinglayer 214 results from a chemical reaction between the dye within thelight-shielding layer 214 and the adhesive coated on one side of thepolarizer 216. The out-diffusion of dye within the light-shielding layer214 contaminates the display area of the liquid crystal display.

In an embodiment of the present invention, the protection layer 260 canbe formed using an ink jet printing method, a screen printing method ora gravure printing method. The area of the protection layer 260 is, forexample, larger than light-shielding layer 214 such that thelight-shielding layer 214 does not have direct contact with thepolarizer 216.

Fourth Embodiment

FIG. 9 is a cross-sectional view showing a liquid crystal display panelfabricated using an ODF process according to the fourth embodiment ofthe present invention. FIG. 10 is a cross-sectional view showing aliquid crystal display module fabricated using an ODF process accordingto the fourth embodiment of the present invention. Please refer to FIG.9 and FIG. 10. The structure of the liquid crystal display panel in FIG.9 and FIG. 10 are similar to that in FIG. 5 and FIG. 6 except that aprotection layer 260 is disposed on the light-shielding layer 250. Inother words, the protection layer 260 is disposed between the polarizer218 and the light-shielding layer 250. It should be noted that thelight-shielding layer 250 is encapsulated by the protection layer 260.Therefore, out-diffusion of dye within the light-shielding layer 250 iseffectively prevented.

In an embodiment of the present invention, the protection layer 260 canbe formed using an ink jet printing method, a screen printing method ora gravure printing method. The area of the protection layer 260 is, forexample, larger than light-shielding layer 250 such that thelight-shielding layer 250 does not have direct contact with thepolarizer 218.

According to an embodiment of the present invention, the sealant isdisposed on the first substrate 202 (for example, the thin filmtransistor array substrate). The liquid crystal layer is formed over thefirst substrate 202 within the sealed space defined by the sealant 208.However, the present invention is not limited thereto. The sealant 208can be formed on the second substrate 204 (for example, the color filtersubstrate). The liquid crystal layer is formed over the second substrate204 within the sealed space defined by the sealant 208.

According to an embodiment of the present invention, the black matrixlayer is disposed on the substrate 204 (for example, the color filtersubstrate). After the first substrate 202 is placed onto the secondsubstrate 204, the edges of the substrate 204 are exposed to light tocure the sealant 208 comprising the radiation-curable glue. However, thepresent invention is not limited thereto. The black matrix layer 206 canalso be disposed on the substrate 202 (for example, the thin filmtransistor array substrate). Moreover, as long as the light-shieldinglayer 250 shields leakage light, the black matrix layer 206 and thelight-shielding layer 250 can be disposed on the same substrate or ondifferent substrates.

Accordingly, the present invention has following advantages:

1. In the present invention, the light-shielding layer is formed on thesubstrate. When the liquid crystal display panel is applied to theelectronic product, the light-shielding layer is capable of shieldingthe light leakage at the edges of the bezel in the liquid crystaldisplay module and thereby reducing the light leakage from the liquidcrystal display module.

2. As to the method of fabricating the liquid crystal display panelusing the ODF process, the light-shielding layer is formed on thesubstrate after the liquid crystal display panel is exposed to a lightfor curing the sealant. Therefore, the liquid crystal display panel canbe fabricated using the ODF process fitting the SPGW specification, andalso reduce the light leakage of the liquid crystal display module.

3. In the liquid crystal display panel of the present invention,contamination of the display area, which is caused by out-diffusion ofdye within the light-shielding layer, is effectively prevented by theprotection layer.

The foregoing description of the embodiments of the present inventionhas been presented for purposes of illustration and description. It isnot intended to be exhaustive or to limit the invention to the preciseform or to exemplary embodiments disclosed. Accordingly, the foregoingdescription should be regarded as illustrative rather than restrictive.Obviously, many modifications and variations will be apparent topractitioners skilled in this art. The embodiments are chosen anddescribed in order to best explain the principles of the invention andits best mode practical application, thereby to enable persons skilledin the art to understand the invention for various embodiments and withvarious modifications as are suited to the particular use orimplementation contemplated. It is intended that the scope of theinvention be defined by the claims appended hereto and their equivalentsin which all terms are meant in their broadest reasonable sense unlessotherwise indicated. It should be appreciated that variations may bemade in the embodiments described by persons skilled in the art withoutdeparting from the scope of the present invention as defined by thefollowing claims. Moreover, no element and component in the presentdisclosure is intended to be dedicated to the public regardless ofwhether the element or component is explicitly recited in the followingclaims.

1. A liquid crystal display panel having a display area, comprising: afirst substrate having a first inner surface and a first outer surface;a second substrate having a second inner surface and a second outersurface, wherein the second substrate is disposed above the firstsubstrate; a sealant, disposed between the first substrate and thesecond substrate; a light-shielding layer, disposed on the first outersurface of the first substrate, wherein the light-shielding layer andthe display area are not overlapped; a first polarizer, disposed on thefirst outer surface; a second polarizer, disposed on the second outersurface; and a protection layer, disposed between the second polarizerand the light-shielding layer, wherein the light-shielding layer isencapsulated by the protection layer.
 2. The liquid crystal displaypanel of claim 1, wherein a material of the light-shielding layercomprises ink.
 3. The liquid crystal display panel of claim 2, whereinthe ink comprises black ink, deep-colored ink.
 4. The liquid crystaldisplay panel of claim 1, wherein an optical density of thelight-shielding layer is 2.0 or higher than 2.0.
 5. The liquid crystaldisplay panel of claim 1, wherein the light-shielding layer is disposedon a peripheral area outside the display area.
 6. The liquid crystaldisplay panel of claim 1, further comprising a black matrix layerdisposed on the first inner surface of the first substrate or the secondinner surface of the second substrate.
 7. The liquid crystal displaypanel of claim 6, wherein the light-shielding layer and the black matrixlayer are partially overlapped.
 8. The liquid crystal display panel ofclaim 7, wherein the light-shielding layer and the sealant are partiallyoverlapped.
 9. The liquid crystal display panel of claim 1, wherein theprotection layer comprises pigment, resin or the combination thereof.10. The liquid crystal display panel of claim 1, wherein the firstsubstrate comprises a thin film transistor array substrate and thesecond substrate comprises a color filter substrate.
 11. The liquidcrystal display panel of claim 1, wherein the first substrate comprisesa color filter on thin film transistor array substrate (COA substrate),and the second substrate comprises an opposite substrate having a commonelectrode.
 12. A method of fabricating a liquid crystal display panelhaving a display area, comprising: providing a first substrate having afirst inner surface and a first outer surface; providing a secondsubstrate having a second inner surface and a second outer surface;forming a sealant between the first inner surface of the first substrateand the second inner surface of the second substrate; filling a liquidcrystal layer in a space defined by the first inner surface of the firstsubstrate, the second inner surface of the second substrate and thesealant; forming a light-shielding layer on the first outer surface ofthe first substrate; forming a protection layer to encapsulate thelight-shielding layer; attaching a first polarizer on the first outersurface; and attaching a second polarizer on the second outer surface,such that the protection layer is disposed between the second polarizerand the light-shielding layer.
 13. The method of fabricating a liquidcrystal display panel of claim 12, wherein a material of thelight-shielding layer comprises ink.
 14. The method of fabricating aliquid crystal display panel of claim 13, wherein the ink comprisesblack ink, deep-colored ink.
 15. The method of fabricating a liquidcrystal display panel of claim 12, wherein the light-shielding layer isformed using an ink jet printing method, a screen printing method or agravure printing method.
 16. The method of fabricating a liquid crystaldisplay panel of claim 12, wherein an optical density of thelight-shielding layer is 2.0 or higher than 2.0.
 17. The method offabricating a liquid crystal display panel of claim 12, wherein thelight-shielding layer is disposed on a peripheral area outside thedisplay area.
 18. The method of fabricating a liquid crystal displaypanel of claim 12, further comprising a step of forming a black matrixlayer on the first inner surface of the first substrate or the secondinner surface of the second substrate.